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High Current, Low-Profile Power Inductors
FLAT-PACTM FP1105 Series
Applications
* * * * * * * * Multi-phase regulators Voltage Regulator Module (VRM) Portable electronics Servers and workstations Data networking and storage systems Notebook and desktop computers Graphics cards and battery power systems DCR sensing
SMD Device
Description
* * * * * * * * * * 125C maximum total temperature operation 11.0 x 8.0 x 4.90mm surface mount package Ferrite core material High current carrying capacity Low core losses Controlled DCR tolerance for sensing circuits Inductance range from 101nH to 226nH Current range from 39 to 81Amps Frequency range up to 2MHz RoHS compliant
Environmental Data
* Storage temperature range: -40C to +125C * Operating temperature range: -40C to +125C (Range is application specific) * Solder reflow temperature: J-STD-020D compliant
Packaging
* Supplied in tape and reel packaging, 900 parts per reel, 13" dia. reel
Product Specifications
Part Number FP1105R1-R10-R FP1105R1-R12-R FP1105R1-R15-R FP1105R1-R20-R FP1105R1-R22-R OCL1 10% (nH) FLL2 Min. (nH) 100 72 120 86 150 109 192 138 226 163 Irms3 (Amps) Isat14 @ 25C (Amps) Isat25 @ 125C (Amps) DCR (m) @ 20C K-factor6 81 63 467 66 50 467 46 54 42 0.35 8.6% 467 42 34 467 39 28 467
4 Isat1: Peak current for approximately 20% rolloff at +25C. 5 Isat2: Peak current for approximately 20% rolloff at +125C. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH), I (peak-to-peak ripple current in amps). 7 Part Number Definition: FP1105Rx-Rxx-R * FP1105 = Product code and size * Rx is the DCR indicator * Rxx= Inductance value in H, R = decimal point * "-R" suffix = RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 3 Irms: DC current for an approximate temperature rise of 40C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125C under worst case operating conditions verified in the end application.
05-05-08
BU-SB08211
Page 1 of 4
Data Sheet: 4324
Dimensions - mm
Top View
A = 11.0 Max.
B = 8.0 Max.
C = 4.9 Max.
Bottom View
D = 2.4 0.2
E = 2.3 0.3
Schematic
F = 6.2 Typ.
Left View
Recommended Pad Layout
1
B
C
b
D E 2.8
2.8
1
1105Rx A Rxx wwllyy R
2 Nominal DCR is measured from point "a" to point "b."
F
5.8
2
a
Rxx = inductance value in H (R = decimal point) wwllyy = date code R = revision level
Part Marking: Coiltronics Logo
1105Rx (Rx = DCR indicator)
Packaging Information - mm
1.5 dia 1.5 dia 2.0 4.0
A
1.75
SECTION A-A
1
11.5
1105Rx Rxx wwllyy R
2
24.0 +/-0.3
11.3
8.2
12.0
A
User direction of feed
Supplied in tape-and-reel packaging, 900 parts per reel, 13" diameter reel.
5.2
Temperature Rise vs.Total Loss
50
40 Temperature rise(C )
30
20
10
0 0 0.2 0.4 0.6 0.8 Total loss (W) 1 1.2 1.4 1.6
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BU-SB08211
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Data Sheet: 4324
Inductance Characteristics
OCL vs. I sat1
100%
80%
% of OCL
60%
40%
20%
+125C +25C -40C
0% 0% 20% 40% 60% % of I sat1 80% 100% 120%
Core Loss
Core Loss vs. B p-p
10 1MHz 500kHz 300kHz 200kHz 1 100kHz
Core Loss (W)
0.1
0.01
0.001
0.0001 100
1000
10000
Bp-p (Gauss)
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BU-SB08211
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Data Sheet: 4324
Solder Reflow Profile
TP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s TL Preheat A t tP TC -5C
Table 1 - Standard SnPb Solder (T c)
Package Thickness <2.5mm _ >2.5mm Volume mm3 <350 235C 220C Volume mm3 _ >350 220C 220C
Temperature
T smax
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin ts
Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm
Time
Volume mm3 <350 260C 260C 250C
Volume mm3 350 - 2000 260C 250C 245C
Volume mm3 >2000 260C 245C 245C
25C
Time 25C to Peak
Reference JDEC J-STD-020D
Profile Feature Preheat and Soak * Temperature min. (Tsmin) * Temperature max. (Tsmax) * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature Standard SnPb Solder 100C 150C 60-120 Seconds 3C/ Second Max. 183C 60-150 Seconds Table 1 20 Seconds** 6C/ Second Max. 6 Minutes Max. Lead (Pb) Free Solder 150C 200C 60-120 Seconds 3C/ Second Max. 217C 60-150 Seconds Table 2 30 Seconds** 6C/ Second Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645
Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607
Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire * LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719
Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
(c) 2008 Cooper Bussmann St. Louis, MO 63178 w w w. c o o p e r b u s s m a n n . c o m
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Data Sheet: 4324

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